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- Sku: New_Spare_Parts_044571
- Availability: In Stock
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1. Reflow soldering heating platform, 5 professional mode selection, 3 common mode operation_x000D_
2. Especially for the original solder of mobile phone motherboard, curve heating, intelligent and safe desoldering and reflow_x000D_
3. The traditional single heating element is banned, and the new MCH ceramic double heating element is adopted, which has faster heating, more uniform temperature, and stable performance_x000D_
4. 5 application scene modes of degumming, layering, lamination, tin planting, and welding can be switched arbitrarily_x000D_
5. 3 commonly used memory temperatures, automatic recording of the current temperature (save when power is off) and manual recording of the current temperature mode_x000D_
6. Turbofan blades for heat dissipation, built-in strong wind cooling system, the fan adapts the speed according to the temperature to dissipate heat_x000D_
7. Monitor temperature changes and realize reflow soldering temperature curve data monitoring_x000D_
8. Real-time detection of motherboard heating and cooling temperature, no need to switch interface to view_x000D_
9. Scope of application: For iPhone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/ 12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max_x000D_
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