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- Product Code: 24644
- Sku: 32938
- Availability: In Stock
$148.99
Main specifications
All specifications
One Package Weight:
3.61 Kg
Delivery Information
Express Shipping By DHL, 3-5 Days To Any Place In The World Yanwen Express 7 - 14 Days To Any Place In The World China Post 10 - 35 Days To any Place In The Word
1. Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, intelligent 15 minutes sleep
2. 183 degrees three minutes extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard
3. For iPhone 12 series
4. Also supports CPU, hard disk IC, baseband IC degumming
5. Professional repair tools aim to give assistance during device repairing.
6. Through the unique bonding function of the welding platform, the upper and lower layers of the motherboard can become more standard when bonding
Specifications
Weight
One Package Weight
3.61 Kg
1. 3D touch FPC connector on motherboard replacement for iPhone 11 Pro.2. This part is used to replace your damaged or unworkable one with a new one.3. Each item has been checked and in good condition before shipping.4. Completely fit and work.5. Pro..
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1. Glass back cover replacement for iPhone 13 Pro Max, no need to disassemble the damaged back cover._x000D_
2. Replace your broken or unworkable back housing cover with a new one_x000D_
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1. Brand new and high quality fingerprint button for Xiaomi Mi 5.2. Replace your broken, damaged or non-working one.3. Each item has been checked and in good condition before shipping.4. Professional installation is highly recommended. We will not be..
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1. Back cover replacement for Xiaomi Redmi Note 10 Pro/Redmi Note 10 Pro Max/Redmi Note 10 Pro India_x000D_
2. Replace your broken or unworkable back housing cover with a new one_x000D_
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