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JP-19 Thermostatic Soldering Platform for iPhone X / XS / XS Max Motherboard layering Upper Lower Separation Glue Remove, US Plug

  • Product Code: 14371
  • Sku: 22250
  • Availability: In Stock
$46.99

Main specifications
All specifications
One Package Weight: 0.51 Kg
Delivery Information

Express Shipping By DHL, 3-5 Days To Any Place In The World Yanwen Express 7 - 14 Days To Any Place In The World China Post 10 - 35 Days To any Place In The Word

1. Support 110V/220V two kinds of voltage, the temperature is 200 degree centigrade.

2. Constant high temperature, porous heat dissipation, one-key separation.

3. Double step positioning, safe disassembly, detachable and weldable.

4. Positioning degumming tank, all kinds of chips easy degumming.

5. Silica gel is completely surrounded, anti-slip and heat-resistant to prevent current leakage.

6. High purity copper plate, extension design, professional welding tools.

7. High precision CNC machining, heat evenly without damage to the motherboard.

Tags: Repair Tools, Repair Platform,

Specifications
Weight
One Package Weight 0.51 Kg