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- Product Code: 17208
- Sku: 25592
- Availability: Out Of Stock
$23.76
Main specifications
All specifications
One Package Weight:
0.28 Kg
Delivery Information
Express Shipping By DHL, 3-5 Days To Any Place In The World Yanwen Express 7 - 14 Days To Any Place In The World China Post 10 - 35 Days To any Place In The Word
1. Used to locate and relocate mobile phone PCB BGA parts
2. Re-bombard BGA quickly and easily without any damage, providing a solution for iPhone 11 Pro / Pro Max BGA repositioning and repair
3. Strong magnetic adsorption, simple operation
4. Stencils will not deform under high temperature
5. Fast and convenient soldering
Specifications
Weight
One Package Weight
0.28 Kg
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