Kaisi Mainboard Middle Layer Board BGA Reballing Stencil Plant Tin Platform for iPhone X / XS / XS Max

  • Product Code: 19606
  • Sku: 28398
  • Availability: In Stock

Main specifications
All specifications
One Package Weight: 0.28 Kg
Delivery Information

Express Shipping By DHL, 3-5 Days To Any Place In The World Yanwen Express 7 - 14 Days To Any Place In The World China Post 10 - 35 Days To any Place In The Word

1. Strong magnetic adsorption, simple operation

2. Fast and convenient soldering

3. High temperature resistance and easy heat dissipation

4. Pewter can be planted accurately at mesh position

5. No damage to the motherboard, accurate positionin

Tags: Repair Tools, BGA Stencils

One Package Weight 0.28 Kg