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Kaisi A-12 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone XS Max / XS / XR

  • Product Code: 19170
  • Sku: 27748
  • Availability: In Stock
$6.99

Main specifications
All specifications
One Package Weight: 0.06 Kg
Delivery Information

Express Shipping By DHL, 3-5 Days To Any Place In The World Yanwen Express 7 - 14 Days To Any Place In The World China Post 10 - 35 Days To any Place In The Word

1. Professional tool for mobile phones repairing.

2. Suitable for iPhone XS Max / XS / XR.

3. The unique holes design makes it easier to take out the formed solder balls.

4. This stencil is easy to use no matter you are a new or expert.

5. Special design enables stencil to align with tinning position of CPU rapidly.

6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal.

7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design.

8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending.

9. Special steel manufacturing, high temperature resistance, no deformation.

Tags: Repair Tools, BGA Stencils

Specifications
Weight
One Package Weight 0.06 Kg