$0.00
Checkout- Product Code: 17214
- Sku: 25599
- Availability: In Stock
$26.99
Main specifications
All specifications
One Package Weight:
0.7 Kg
Delivery Information
Express Shipping By DHL, 3-5 Days To Any Place In The World Yanwen Express 7 - 14 Days To Any Place In The World China Post 10 - 35 Days To any Place In The Word
1. Used to locate and relocate mobile phone PCB BGA parts
2. Convenient and quick re-bombardment of BGA without causing any damage, suitable for iPhone 11/11 Pro / 11 Pro Max BGA repositioning and repair to provide solutions
3. Unique hole design makes it easier to take out the formed solder balls
4. Fast and convenient soldering
5. Size: about 13x9x1.7cm
Specifications
Weight
One Package Weight
0.7 Kg